OSDA’S Manufacturing Difference

Issue:
The component manufacturer had recommended specific instructions to increase the solder mask coverage for their LGA component. When OSDA received the PCB, an alternate pad configuration was used. This caused a number of opens, during the manufacturing process.

Resolution:
Due to quickly seeing the solder mask problem, OSDA decided to build the assembly without installing the LGA, prior to the reflow operation. An OSDA rework specialist added solder to the surface lands building them up to insure they exceeded the solder mask height. The component was then installed by our standard SMT equipment and the board was then sent through the reflow oven. No opens were found after this process and by using its quick observation of the problem, its unique solution to the problem, OSDA was able to meet its committed delivery and assure the quality of the product met all industries standards.